| 20 um blind via laser drilled in 25 um (1 mil) polyimide with a 10um laser spot. As increasing optical performance enables smaller via diameters, practical limits are imposed by plating technology, particularly for smaller diameter, higher aspect ratio blind vias, where plating must be consistently 'thrown' to the bottom of the hole. |
High aspect ratio 10 um via laser drilled in 50 um (2 mil) polyimide. As customer requirements continue to evolve, MicroConnex is investing in developing and refining the processes necessary to drill and plate such small diameter, high aspect ratio microvias. |
