<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.01 Transitional//EN"> <html> <head> <title>MicroConnex</title>
+1 425-396-5707
<span class="PageTitle">Flex Circuit Capabilities</span> </p> <p>Listed below are our standard materials and specifications for flex circuits. MicroConnex fabrication capabilities enable us to provide a wide range of options to help facilitate the production of demanding designs. We offer innovative solutions to challenging flex circuit designs and can support prototype to mid-volume production quantities.</p> <h4>1. Materials</h4> <p> <strong>Substrate:<br></strong>Polyimide/Kapton film: 25, 50 and 75 microns<br> Design-dependent materials: LCP, BT, PEEK<br> <strong>Cover Layers:</strong><br> Polyimide: 25, 27, or 60 micron
Photoimageable solder mask: 25 micron<br> <strong>Adhesive:</strong><br> <strong>Conductors:</strong><br> <strong>Stiffeners:</strong><br> Epoxy-glass (FR-4), Polyimide Cirlex<br> <strong>Finishes:</strong><br> Copper<br> ENIG/ENEG<br> OSP
Electroplated Nickel </p> <strong>Plating/Metals:</strong><br> Copper<br> Nickel<br> Gold</p> <h4>2. Physical Properties</h4> <p><strong>Maximum size:</strong><br> <strong>Tolerance:</strong><br> <strong>Flexibility:</strong><br> <strong>Temperature:<br></strong> <strong>Chemical resistance:</strong><br> <h4>3. Electrical Characteristics</h4> <p><strong>Insulation resistance:</strong><br> <strong>Wire coils:</strong><br> <strong>Shielding:</strong><br> <h4>4. Connections</h4> <p> <strong>Interlayer:</strong><br> <strong>Components:</strong><br> <strong>Pins:</strong><br> <strong>Connectors:</strong><br> </p> <p>
<table width="720" border="0"> <tr> <td><img src="images/clear.gif" height="5"></td> </tr> <tr> <td class="footertext" align="center">Copyright &#169; 2007 MicroConnex, Inc. All Rights Reserved </td> </tr> </table> </body> </html> </html>