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| The integration of laser direct write methods with photolithography, chemical etching, and additive electrolytic or electroless plating reduces laser throughput times while utilizing the strengths of existing manufacturing techniques. | |||
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| In this prototype of an IC test interface, laser direct write is used only for the finely detailed portion of the circuit, while bulk circuit features are fabricated with more conventional methods. | Detail view of the combination of laser direct write and conventional photolithographic traces. Quick and accurate fabrication of fine details can often provide an advantage to the developer of complicated circuits and devices. | ||
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