MicroConnex Etch Resist Ablation

	In negative direct write using a resist, the laser writes a negative image of the desired circuit by ablating the resist over the spaces in the desired circuit pattern, leaving the pattern of circuit traces protected by the resist.

	Laser ablated etch resist in the first step of fabricating a circuit using negative direct write; trace pitch here is 30 um.	After ablation the exposed metal base layer is etched away, leaving the circuit traces, exposed after the protective layer of etch resist is removed.