MicroConnex Thermal Evaporation

	Laser Drilling through inhomogeneous, multi-layer structures requires careful control of laser parameters to achieve the desired hole while maintaining substrate integrity.

	Different materials in a multilayer circuit - e.g. metal, dielectric, stiffeners, adhesives, etc. - will typically ablate at different rates, resulting in variably shaped through holes.	Tailoring the laser drilling algorithm to the specific material stackup results in a more consistent through hole geometry, which can be important for fine pitch, densely packed circuits.