Laser Direct Write Circuit Fabrication

MicroConnex is a pioneer of laser direct write processes. Methods which we have developed are useful for rapid fabrication of fine scale flex circuits and MEMS devices down to a 10 um feature size. By eliminating film-based photolithography, direct write prototyping allows for fast turnaround and quick design changes.

High aspect ratio structures can be formed with typical flex materials for electronics applications that need to maximize cross-sectional areas, and are also available for MEMS applications using various polymeric materials.

MicroConnex has developed Laser Direct Write methods to perform:

•	Positive direct write, i.e. to directly write a circuit pattern by selectively crosslinking photosensitive resist materials.
•	Etch resist ablation, to directly write a negative of a circuit pattern in a resist layer.
•	High throughput negative pattern ablation, to directly pattern base layer metals on polymer substrates down to 50 um.
•	Combined laser direct write and photolithography, reducing laser throughput times by using direct write methods only where required, and taking advantage of conventional methods for larger scale circuit features.

Close collaboration with our laser partner, Electro Scientific Industries, allows us to combine custom laser control software with advanced beam shaping optics as we continue to develop advanced direct write processes for specialized applications.