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Complex flex circuit allows advances in sensor development

Customer: European Developer of Sensor Technology

Challenge: Produce a flexible circuit that allows vias to be drilled through the top and bottom trace layers with an accuracy of plus or minus 3 microns across the part.

Solution: Extremely tight laser drilling registration of vias and fine line patterning

Benefits: MicroConnex' capabilities enabled the customer to complete their design and prototype of an advanced sensor application. Prior to MicroConnex' success, six (6) flex circuit manufactures failed trying to produced the part.

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Unique flexible circuit design used to make a High-current transformer solves design challenge

Customer: Military and Defense Contractor

Challenge: Use flexible circuit technology to build a planar transformer comprised of primary and secondary windings, with very high current carrying capability.

Solution: Design and build a circuit with 50 micron line and space, and with 27 micron thick traces. Solve persistent problems associated with design requirements:

  • Very thick copper traces on the surface of thin polymers
  • Thick bonding layers are required to conform to the traces and also provide insulation between layers
  • High layer count - ultimately 54 layers
  • PTH problems resulting from thick dielectric and thick conductor layers requires unusual solutions

Benefits: MicroConnex was able to overcome all of the problems caused by the combination of design parameters.

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Elegant flexible circuit enables biometric interface

Customer: University of Washington

Challenge: A researcher needed to attach a sensor with an inductor coil to a mouse's eyeball. Solder terminations at the sensor had proven to be very difficult.

Solution: The MicroConnex design replaced the hand wound coil with a flexible circuit which included an integral lead. This allowed solder terminations to be made at a safe distance away from the eye.

Benefits: The MicroConnex sensor included an inductor that was smaller and lighter than the wire-based device which allowed more windings to be put into the small space. Using MicroConnex' unique laser direct-write capabilities, this project was completed in a very short amount of time, allowing the customer to pursure additional research funding.

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Design, qualification and test of 3-layer flexible circuit.

Customer: U.S. Designer of Handheld Electronics

Challenge: Design, qualify and test a multi-layer flex circuit as a shielded 50 ohm transmission line that can withstand a large number of flex cycles.

Solution: Evaluate and re-design (if necessary) seven different flex circuits and develop a unique test device to qualify each component.

Benefits: MicroConnex' capabilities enabled the customer to introduce a new consumer electronics product.

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