Laser Drilling

With the MicroConnex ESI 5200 and 5330 ultraviolet laser systems, we provide quick turn drilling services for board shops, flex circuit manufacturers and others, on an ongoing basis or to provide overflow capacity.

Our laser drills operate at a wavelength of 355 nm (frequency tripled Nd-YAG), with a spot size of 25 um and spatial resolution in the um range; advanced custom optics can provide spot sizes down to 10 um for specialized applications.

Standard laser services include:

- Through hole drilling in multi-layer circuits
- Blind vias
- Microvias (down to 25 um/1 mil)
- 10 um drilling is available for specialized applications
- Dielectric ablation
- Advanced feature patterning and cut-out capabilities.
- Drill through metalization with no additional masking required

Lead time for standard laser work is one week from receipt of a CAD file and expedited service is available. For information about submitting files for a quote see our laser drilling guidelines.

MicroConnex has also developed advanced, proprietary methods of Laser Micromachining and Direct Write circuit patterning, and collaborates with customers in the design and development phase to incorporate these methods in Custom Development projects.

Examples