Laser Micromachining

Custom laser micromachining is available for R&D projects, for quick turn prototype fabrication and to fill ongoing manufacturing needs. As a non-contact method, laser micromachining is often appropriate for projects involving complicated patterns and/or delicate materials, and is sometimes the only feasible approach for machining difficult microstructures.

Our laser drills operate at a wavelength of 355 nm (frequency tripled Nd-YAG), with a spot size of 25 um and spatial resolution in the um range; advanced custom optics can provide spot sizes down to 10 um for specialized applications.

Laser micomachining capabilities include:

- Through hole drilling in multi-layer circuits
- Blind vias
- Microvias (down to 25 um/1 mil)
- 10 um drilling is available for specialized applications
- Dielectric ablation
- Advanced feature patterning and cut-out capabilities.
- Drill through metalization with no additional masking required

Laser micromachining is suitable for materials which are UV opaque. Fortunately this includes most materials; teflon and some quartzes are examples of materials which are sufficiently UV transmissive to cause problems.

The ESI 5200 and 5330 laser systems used by MicroConnex offer 2~5 um positional accuracy over a 22x26" work surface. Standard spot size is 25 um, with a 10 um spot available for specialized applications through the use of advanced beam shaping optics.

Feature depths up to ~500 um (0.5 mm) can be efficiently machined in metals and from one side. Thicker materials will require increased processing time due to optical shielding by the walls of the laser kerf; this can be reduced if it is possible cut fiducials through the part and machine from both sides. Thermally sensitive materials require longer processing times to allow heat dissipation, however laser methods can still be appropriate for expensive materials or high value projects. Surprisingly good results can be obtained in extremely thermally sensitive materials, e.g. single crystal ferro-electrics, with a laser algorithm tailored to the material and the particular cutting pattern.

Projects at MicroConnex range from overflow manufacturing support from customer supplied CAD files, available on an as-needed basis, to development of advanced laser algorithms and custom tooling to fabricate complicated two and three dimensional structures. We work closely with our customers to develop new laser applications, often closing the loop in house with immediate customer feedback, which can provide an efficient route to choices of materials and laser methods which will meet functional requirements.

Examples