MicroConnex Company History
MicroConnex History
DARPA and the Search for Dense Flex Circuits
MicroConnex was founded by Thomas Clary and Scott Corbett in 1995. The original name of the company was “MicroSound Systems”. MicroSound started as a R&D company, exploring new designs and manufacturing methods to make ultrasound transducers using laser micromachining.
MicroSound received contracts from the Defense Advanced Research Projects Agency (DARPA) and the US Navy as part of a battlefield imaging emphasis. The initial funding allowed the acquisition of our first laser system (an ESI 5100).
Simultaneously, we began developing the technology and expertise required to make dense flex circuits as part of the ultrasound transducer effort. We applied for and received grants from the US Army and the National Institutes of Health. These early grants established us as a leader in innovative interconnect and packaging technology in the medical and defense markets.
Shifting From R&D to Flex Circuit and Laser Micromachining
In 2000, we moved to a new building in Snoqualmie and completed a small private placement investment round. We changed our name to MicroConnex to reflect the shift in focus from research and development services to commercial flex circuit design and laser micromachining, thereby servicing a broader electronic packaging market. At roughly the same time we also developed and acquired thin-film sputtering technology and equipment.
Developing Our Core Technologies
In the next few years we developed advanced flex technology involving proprietary photolithographic patterning, alignment, and laser-drilling techniques, which allowed us to produce densely patterned substrates. This capability gave us the ability to manufacture unique circuits for a wide variety of electronic systems.
The result of our advances in flex technology and laser micromachining has been the ability of electronic system manufacturers to produce smaller, “smarter,” more portable devices.
While medical ultrasound continued to be a major market for our flex circuits, we became a supplier to a wide variety of commercial companies in the medical, defense, aerospace, and computer industries.
The laser micromachining services business also grew. We’ve become a significant provider of micro-drilling services for the computer chip testing and other industries. Our position in the market became stronger with our acquisition of an ESI 5330, an upgrade of our 5100 to a 5200, and our purchase of an ESI 5330HE. The combination of the three laser machines gives us a wide range of possible uses and significantly expands our laser technology infrastructure.
MicroConnex Today
MicroConnex currently occupies over 18,000 square feet in the Inception Group building which includes laboratory, office and manufacturing space for flex circuit, rigid-flex and laser micromachining fabrication.
In 2010, the company hired a new president, Paul Henwood. With the company’s strong technology base and the growing significance of interconnect technology in the world’s unrelenting quest for “smaller, faster, smarter” products, we anticipate Microconnex will see continued strong growth in the years ahead.