Services and Capabilities

MicroConnex is a recognized leader in high-end flex circuit technologies. We offer a comprehensive range of capabilities, including:

- multilayer flex circuit fabrication
- laser micromachining
- thin film and plasma processing
- electronic packaging
- circuit assembly

We specialize in lower volume difficult-to-fabricate products, yet can help you find economical solutions for larger volumes. We can work with substrates less than 1 mil (25 um) thick, and trace pitches below 1 mil (25 um). We also offer custom development services ranging from specialized process development to turn-key engineering solutions for MEMS devices.