Our customer needed a flexible printed circuit that allowed vias to be drilled through the top and bottom trace layers with an accuracy of +/- 3 μm across the part. Six flex circuit manufacturers had attempted but failed to produce this circuit.
Services & Solutions
The circuit required extremely tight laser drilling registration of vias and fine-line patterning. The tight drilling involved the laser system’s spot size and advanced optical focal lens as well as the “motion stage” and control to align for layer-to-layer registration in the sub 10 μm range.
Our capabilities enabled the customer to complete design and prototyping of an interposer for an advanced sensor application within the semiconductor test industry. This flex-interposer significantly reduced their overall test time and costs by more than 33%.