Ultra-tight Tolerances in 3 Layers with Flying Leads

Background

This major manufacturer of medical devices for cardiac mapping required a 25 μm circuit with 27 μm copper in 3 layers with flying leads, tight via/pad registration, and ultra-tight spacing. If it could be produced, this circuit would eliminate hours of assembly time and save thousands of dollars.

Services & Solutions

Our customer said that other vendors had tried but failed to build the flexible printed circuit, but we knew that our collaborative engineering approach would uncover a solution. We pored over the sample board created by another vendor and went through four or five iterations of our engineering run to refine the details. It was the purest of team efforts, as no one engineer could have possibly seen the ultimate solution.

Results

In the end, we reduced assembly time for their ultrasound transducer by a full eight hours, saving the customer thousands of dollars.