MicroConnex: acquires Laser Direct Imaging (LDI)

For Immediate Release

MicroConnex, a rapidly growing Flex Circuit fabricator in the Seattle area who has a reputation for producing some of the world’s best complex- fine-line / fine-pitch designs today announced the purchase, installation, and deployment of an Orbotech Paragon 9800m Laser Direct Imaging system—aka the LDI.

This million-dollar investment adds to MicroConnex’ already extraordinary capability in the “sub 1 mil” category of tight lines and spaces within the niche market of complex flexible electronic circuitry. Specifically the new LDI streamlines MicroConnex’ proprietary processes with tighter and consistent trace, space, trace-to-edge and layer-to-layer registration.

Simultaneously, the LDI is helping MicroConnex improve overall efficiency and scale across their spectrum of capability including quick-turn prototypes delivered generally within 5 days or less. Justin Jordan, Applications Engineering Manager says: “We’re only 3 weeks into the deployment and have seen dramatic and amazing improvements with registration accuracies alone.”

Sam I., MicroConnex’ Operation Manager says “The LDI is key to achieving the most accurate registration results in the area of pad to via, layer to layer, and soldermask alignment. It also provides greater throughput and yield improvements generally associated with standard photolithography processes.”

Earlier this year MicroConnex purchased a significant set of capital equipment including a Chemcut 547 XL 20″ Developer and a Chemcut 547 XL Dry Film Stripper configured for ultra-thin transport of sub 3 mil material cores, an Encon Thermal Evaporation and Distillation System along with the 4th ESI 5330HE UV laser system. MicroConnex also implemented “TrueChem” validating the overall process.

About MicroConnex: MicroConnex is a leading supplier and production partner for flex circuits and laser micro-machining. They easily incorporate smaller, lighter and more reliable flex circuits in product designs by using patented electrical technology, proprietary connective techniques, advanced laser processes and thin-film sputtering capabilities. MicroConnex flex circuits are used in applications where lightweight, ultra-compact design and reliability are all critical. They commonly say: “Challenge our Team”.

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For more information about this topic, or to speak with a MicroConnex representative, please call Wayne VanZandt at 425-396-5707 or email Wayne at wvanzandt@microconnex.com. URL: https://www.microconnex.com