Fast Prototyping & Manufacturing of Smaller, Lighter, and More Reliable Flex Circuits
Our technical teams can produce your standard flex prototype in 5 days and developmental flex prototype in 15 days. Challenge us with multilayer, sub 2-mil thickness, tight registration, and a high number of traces. Give us your toughest HDI with a specific RF performance requirement. Ask us to make your flex circuits smaller, lighter, and more reliable.
Our flex circuit capabilities can meet rigorous requirements, like these:
- 1 mil (25 μm) trace/space
- 25 μm vias and critical dimensions of laser ablated features to 10 μm
- Complex 3+ layer HDI flex circuits that other shops won’t touch