Laser Micromachining Services: Depths up to 500 μm on Metallic Substrates

Laser drilling through heterogeneous, multilayer structures requires careful control of laser parameters to achieve the desired feature while maintaining substrate integrity. Because different materials ablate at different rates, we tailor the laser drilling algorithm to the specific material to achieve highly consistent geometries. This is especially important on substrates with densely packed circuits or features.

Our laser micromachining services and laser drilling capabilities include the following:

High Aspect Ratio Microvias, Blind Vias, and Buried Vias

We can drill very small diameter (25 μm) high aspect ratio microvias, blind vias, and buried vias with an extremely high degree of accuracy. Our expertise enables us to regularly exceed the OEM spec of +/- 10 μm positional accuracy over a 12 in x 12 in stage. Standard spot size range is 12 μm to 25 μm, with a 10 μm minimum feature size capability for specialized applications through the use of advanced beam shaping optics.

Dielectric Laser Ablation and Skiving

Flying leads are often used as connection points for fine-scale interconnects to high-density piezoelectric transducer arrays, where mass loading must be minimized. After circuit fabrication, the Kapton® polyimide may be removed by low power laser ablation, exposing the circuit traces for subsequent processing.

Dicing, Micromachining, and Marking

Precise laser control enables patterning and cutout of complex features in a wide range of materials and thicknesses.

Drill-through Metallization

Our drill-through metallization requires no additional masking.


Challenging Architectures in Traditional and Novel Material Sets

Our laser micromachining services exemplify our team’s deep engineering expertise developed over time across a range of challenging architectures in traditional and novel material sets. We routinely machine features to depths up to 500 μm in blind and through-hole architectures across a range of metallic substrates. More thermally sensitive materials such as ferro-electrics have also been machined to similar dimensions using proprietary processing algorithms and cut patterns to manage heat dissipation. We can create MEMS prototypes faster and at a lower cost than conventional methods with our fine-line laser ablation processes.

We welcome unique processing challenges in materials, designs, and critical dimensions. From proof-of-concept to prototyping to manufacturing, our laser specialists use their collective experience and cutting-edge equipment to meet new and increasingly complex customer requirements.


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