CAPABILITIES
Your Idea.
Our Capability.
Advantage Delivered.
We fabricate to your specifications while contributing DFM and integration expertise on HDI flex circuits, laser drilling, and cutting on thin materials. MicroConnex operates within the ISO 9001 framework to ensure quality and consistency from proto to manufacturing.
Choose MicroConnex as your flex circuit supplier, and see how your design can gain a competitive advantage from our direct experience in these industries:
Medical devices
Biosensors and implants
Ultrasound and ultrasonic sensors
Wearable technology
Integrated circuit testing
Download our pdf capabilities & Guidelines chart
View this downloadable table of our capabilities, including the types of circuits we work with and the materials we use.
Complete the form to access this PDF
Sputtering is a micro-fabrication process used to deposit thin optical films, barrier and adhesion layers, and to create embedded components like resistors, sensors, and implantable electrodes.
thin film deposition.
The MicroConnex thin film work center specializes in high-quality thin film deposition for custom manufacturing and R&D using DC, pulsed DC, and RF magnetron sputtering. Our automated PVD systems deposit metals, metal oxides, and semiconductors with precise control, uniformity, and full process tracking on substrates up to 6×6 inches and 3 μm thick. Films can be applied as blanket coatings or patterned using photolithography or shadow masks.
Let’s Work Together.
Share your challenge. We'll develop a custom solution.