Platforms
Flex Circuits. Reimagined Lighter. Engineered Stronger.
Our technical teams can produce your flex prototype with varying degrees of complexity
Our flex circuit capabilities can meet rigorous requirements, such as:
1 mil (25 μm) trace/space
25 μm vias and critical dimensions of laser ablated features to 10 μm
Complex 3+ layer HDI flex circuits that other shops won’t touch
Need Long Flex? We Build It.
MicroConnex specializes in building long flex circuits designed for demanding applications where space, reliability, and signal integrity matter. Our advanced fabrication capabilities allow us to produce extended-length flex assemblies with consistent performance, tight tolerances, and excellent durability across complex routing paths. From prototype through production, we help customers push the limits of design with long flex solutions that enable more compact, efficient, and reliable systems.
Why Flex Circuits?
Thickness & Package Size
Because flexible circuits use the thinnest dielectric substrates available, it’s possible to produce flex circuits with a total thickness approaching 1 mil (25 μm), including a protective cover layer.
Reduction in Assembly Time, Errors, and Cost
Flex circuits can reduce product assembly time because they seamlessly integrate form, fit, and function into a single circuit. A reduction in assembly time also reduces manufacturing errors and costs.
Weight
Smaller circuits are naturally lighter. Some applications result in a weight reduction of 50% or more over rigid or rigid-flex designs. Our dielectric material sets are thin in dimensional thickness and use lighter “copper weights,” resulting in a lightweight, highly flexible circuit construction.
Complete the Circuit.
Share your challenge. We'll develop a custom solution.