Case Studies
High-Density Interconnect for Custom Silicon
A customer approached MicroConnex in search of a high-density interconnect solution for their custom silicon.
Ultra-tight Tolerances in 3 Layers with Flying Leads
This major manufacturer of medical devices for cardiac mapping required a 25 μm circuit with 27 μm copper in 3 layers with flying leads, tight via/pad registration, and ultra-tight spacing.
Flex Circuit’s Ability to Withstand High Operating Temperatures
Our customer, a leading provider of advanced MEMS-based accelerometers for rugged and hostile environments, had tried but failed to create a circuit that could continuously operate at +125°C.
Complex Flex Circuit and Advances in Sensor Development
Our customer needed a flexible printed circuit that allowed vias to be drilled through the top and bottom trace layers with an accuracy of +/- 3 μm across the part. Six flex circuit manufacturers had attempted but failed to produce this circuit.
Elegant Flexible Circuit for Biometric Interface
Our customer, a local researcher, needed to attach a sensor with an inductor coil to a mouse’s eyeball. Solder terminations so close to the eye were challenging because they were too thin and too small to solder with conventional solder techniques.