Complex Flex Circuit and Advances in Sensor Development

Background.

Our customer needed a flexible printed circuit that allowed vias to be drilled through the top and bottom trace layers with an accuracy of +/- 3 μm across the part. Six flex circuit manufacturers had attempted but failed to produce this circuit.

Services & Solutions.

The customer’s design called for a fine line (under 2 mil) and very tight registration. These elements, along with the high number of traces, thin total stack up, and required flexibility made it extremely hard to manufacture.

Results.

Our capabilities enabled the customer to complete design and prototyping of an interposer for an advanced sensor application within the semiconductor test industry. This flex-interposer significantly reduced their overall test time and costs by more than 33%.